Default process: FR-4, green and white lettering, with lead spray tin. Copper foil 35UM (10Z). 1.6mm thick plate with hole cover oil. If you don't have any special requirements, we will follow this process. Process capability: number of layers: 2-20, blind holes, buried holes. Minimum line width: 5ml. Minimum line spacing: 5ml. Minimum hole diameter: 0.2mm (8mil). Board thickness: 0.3-3.2mm. Gold finger surface process: lead-free tin spraying, gold plating, gold deposition, OSP oxidation resistance. Colors: green, red, blue, yellow, white, black (prices vary depending on the color). Surface copper thickness: 18-90 μ m. Hole copper thickness: ≥ 20 μ m. Finished board warpage (minimum): ≤ 0.5%. Thermal shock: 265 °, 20s

Our company has multiple engineers who have been engaged in PCB design and wiring work for many years, as well as precision instruments and equipment for PCB copying and optical drawing production, which can ensure extremely high board copying accuracy and work efficiency, ensuring successful cloning in one go! Trust is the beginning of cooperation, and technology is the proof of strength! Single and double board copying fee: starting from 100 per square centimeter/0.8 (for high-precision boards, the difficulty level depends). Multi layer board copying fee: starting from 400 per square centimeter/2